Chip Component Barrel Plating Automatic Line
Hengli Eletek Co., Ltd.- Type：Coating Production Line
- Coating：Plating
- Substrate：Ceramic
- Certification：CE, ISO, RoHS
- Condition：New
- Transport Package：Standard Exported Package
Base Info
- Model NO.：Barrel plating line
- Specification：CE, ISO9000, SGS,
- Trademark：Hengli
- Origin：China
- HS Code：8543300090
Description
Basic Info.
Model NO. Barrel plating line Specification CE, ISO9000, SGS, Trademark Hengli Origin China HS Code 8543300090Product Description
Application:The mass plating production of chip component and micro metal parts;Pretreatment, silver plating, nickel plating and tin plating of chip components.<o:p>
Project experiences:Electroplating production line for SMD and connectors etc.<o:p>
Feature:The roller is optimal designed of technology according customers requirements. Having reliable system, high efficiency, bright fine and uniform appearance. The line takes man-machine interface touch-screen control management. It can effectively monitor the data, PH, time and running conditions etc,and is easy to adjust process parameter according to different process feature.<o:p>
Technical Specification: Cantilevered crane, the running rate of crane: 0-25 m/min, lifting rate of crane: 0-12 m/min, the lifting weight: 50-100 kg.<o:p>
Option: Special roller, solution online testing and automatic feeding, roller with speed regulator, computer control system, and rectifier automatic control.<o:p>
