Electronic Component Barrel Plating Automatic Line - Automatic Plating Line
Hengli Eletek Co., Ltd.- Type：Plating
- Certification：CE, ISO
- Condition：New
- Transport Package：Standard Exported Package
- Specification：IAF, ESI, SGB, UKAS, CSAUS, CE
- Trademark：HengLi
Base Info
- Model NO.：HDZn1200ZD
- Origin：Hefei, China
- HS Code：854330009
- Production Capacity：30 Line Year
Description
Basic Info.
Model NO. HDZn1200ZD Origin Hefei, China HS Code 854330009 Production Capacity 30 LineYearProduct Description
Application: The mass plating production of chip component and micro metal parts; Pretreatment, silver plating, nickel plating and tin plating of chip components.Project experiences: Electroplating production line for SMD and connectors etc.
Feature: The roller is optimal designed of technology according customers requirements. Having reliable system, high efficiency, bright fine and uniform appearance. The line takes man-machine interface touch-screen control management. It can effectively montior the data, pH, time and running conditions etc, and is easy to adjust process parameter according to different process feature.
Technical Specification: Cantilevered crane, gantry crane, the running rate of crane 0~25mmin, lifting rate of crane 0~12m/min, the lifting weifght 50~200Kg.
Option: Special roller, solution online testing and automatic feeding, roller with speed regulator, computer control system, and rectifier automatic control.
