• Model NO.：CY-3RF
• Sputtering Angle Range：0 – 25° Adjustable 
• Sputtering Distance Range：50 – 80 mm Adjustable
• Vacuum Chamber：High Purity Quartz
• Sealing Flange：Dia.274mm
• Rotation Speed：1-10rpm
• Holder Temperature：Rt-600c
• Keywords：RF Sputtering Deposition Systems
• Warranty：One Year
• Transport Package：Wooden Box
• Specification：dia. 50mm
• Trademark：CY
• Origin：Zhengzhou, China
• HS Code：8486202200
• Production Capacity：210 Sets Per Month

Basic Info.

Model NO. CY-3RF Sputtering Angle Range 0 – 25° Adjustable  Sputtering Distance Range 50 – 80 mm Adjustable Vacuum Chamber High Purity Quartz Sealing Flange Dia.274mm Rotation Speed 1-10rpm Holder Temperature Rt-600c Keywords RF Sputtering Deposition Systems Warranty One Year Transport Package Wooden Box Specification dia. 50mm Trademark CY Origin Zhengzhou, China HS Code 8486202200 Production Capacity 210 Sets Per Month

Product Description

3 Heads Compact 1" RF Plasma Magnetron Sputtering Coater -
 is a three head 1" RF Plasma magnetron sputtering system designed for non-metallic thin film coating, mainly for multilayer oxide thin films. It is the most cost-effective coater for researching in the new generation of oxide thin films. (DC magnetron sputtering option is available upon request.)
 

Input Power	Single phase 220 VAC, 50 / 60 Hz 1000 W (including vacuum pump and water chiller) If the voltage is 110 V, a 1500 W transformer can be ordered
Power Source	13.5 MHz, 100 W RF generator with manual matching is included and connected to the sputtering heads Load range: 0 - 80 oh adjustable. Tuning range: -200j - 200j adjustable Rotatable switch can activate one sputtering head at a time. Sputtering heads can be switched "in the plasma" (no breaking of vacuum and plasma during a multilayer process) Optional 300 W auto-match RF generator is available at extra cost
Magnetron Sputtering Head	Three 1" magnetron sputtering heads with water cooling jackets are included and inserted into quartz chamber via quick clamps RF cable replacement can be purchased One manually operated shutter is built on the flange    One 10 L/min digitally controlled recirculating water chiller is included for cooling sputtering heads
Sputtering Target	Target size requirement: 1" diameter x 1/8" thickness max Sputtering distance range: 50 - 80 mm adjustable Sputtering angle range: 0 - 25° adjustable  1" diameter Cu target and Al2O3 target are included for demo testing Various oxide 1" sputtering targets are available upon request at extra cost
Vacuum Chamber	Vacuum chamber:  256 mm OD x 238 mm ID x  276 mm Height, made of high purity quartz Sealing flange: 274 mm Dia. made of Aluminum with high temperature silicone O-ring Stainless steel shield cage is included for 100% shielding of RF radiation from the chamber Max vacuum level: 10^-4 Torr with optional turbo pump and chamber baking
Sample Holder	Sample holder is a rotatable and heatable stage made of ceramic heater with stainless steel cover Sample holder size: 50 mm Dia. for. 2" wafer max Rotation speed: 1 - 10 rpm adjustable for uniform coating The holder temperature is adjustable from RT to 600 °C max (5 min max at 600 °C; 2 hr max at 500 °C) with accuracy +/- 1.0 °C via a digital temperature controller
Vacuum Pump	KF40 vacuum port is built in for connecting to a vacuum pump. Vacuum level: 10^-3 Torr with included dual stage mechanical pump 10^-4 Torr with optional turbo pump
Size	540 mm L x 540 mm W x 1000 mm H
Net Weight	60 kg
Compliance	CE approval